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de-embedding
- CMOS电路去嵌入，去除焊盘和连接线影响-CMOS circuit is de-embedding, removal pads and cables influence
split-and-merge
- segments image F by using a split-and-merge approach based on quadtree decomposition. MINDIM (a positive integer power of 2) specifies the minimum dimension of the quadtree regions (subimages) allowed. If necessary, the program pads the in
62757
- The following Matlab project contains the source code and Matlab examples used for use fourier interpolation to increase sampling of an image. also includes an optional filter. . Zero-pads the FFT of an image up to the desired size, then performs IFF
pinctrl-atlas6
- pinctrl pads, groups, functions for CSR SiRFatlasVI.
OrCAD_LIB
- 常用的ORCAD原理图库和PADS封装库，可以加快原理图绘制进度-The principle of ORCAD library and PADS Library of commonly used, can speed up the progress of the principle drawing
Cadence Allegro元件封装制作流程
- 一个元件封装的制作过程如下图所示。简单来说，首先用户需要制作自己的焊盘库Pads，包括普通焊盘形状Shape Symbol和花焊盘形状Flash Symbol；然后根据元件的引脚Pins选择合适的焊盘；接着选择合适的位置放置焊盘，再放置封装各层的外形（如Assembly_Top、Silkscreen_Top、Place_Bound_Top等），添加各层的标示符Labels，还可以设定元件的高度Height，从而最终完成一个元件封装的制作。
cadence_元件封装制作
- 一个元件封装的制作过程如下图所示。简单来说，首先用户需要制作自己的焊盘库Pads，包括普通焊盘形状Shape Symbol和花焊盘形状Flash Symbol；然后根据元件的引脚Pins选择合适的焊盘；接着选择合适的位置放置焊盘，再放置封装各层的外形（如Assembly_Top、Silkscreen_Top、Place_Bound_Top等），添加各层的标示符Labels，还可以设定元件的高度Height，从而最终完成一个元件封装的制作。
pinctrl-prima2
- pinctrl pads, groups, functions for CSR SiRFprimaII.
tdk_component_library_v55
- TDK的元件规格书汇总和元件封装，PADS格式，有需要可以下载-TDK components and component packaging specifications summary, PADS format, there is a need to download try
murata_lib_ads2009u1earlier_54e
- 村田元件库汇总，包括PADS下的各种封装和规格书等，非喜勿下-Murata component library summary, including a variety of packaging and specifications under PADS, etc., do not lower non-hi
PT2262
- CMOS technology has been used to implement radiofrequency (RF) integrated circuits. On-chip electrostatic discharge (ESD) protection designs must be added at all input/output pads in RF circuits. To minimize the impacts ESD-CMOS technology h
Indrcemiitonin
- In order to solve the hi#speed circuit design timing and signal integrity problems，combined with the main features ofthe PADS software，and high．8peed circuit design considerations．Taking the HD511 module for example，the paper introduces rules of
all_export_bom
- 很好用的PADS BOM导出工具，支持PADS所有版本，使用的时候原理图属性请符合规则-PADS BOM tool
X7_S_GC1004_V0.1_0902
- 一款很好的汽车行驶记录摄像装作，pADS打开！-A good car recorder camera pretending, pADS open!
02.ReportPinTypeCount
- PADS 二次开发程序,用于统计PCB上的pin数量-PADS secondary development of procedures for the statistical number of PCB on the pin
feilinguanli
- pcb菲林管理 菲林：是曝光的底片.在做PCB线路,阻焊的时候,PCB表面会涂一层感光液体，经过80度的温试烤干，再用菲林贴在PCB板上，再经过紫外线曝光机曝光，撕下菲林。经过药水多余的液体就会去了，做线路时电一层焊就可以蚀成线路。做阻焊时焊盘就可以露出来。-pcb Film Management Film: The film is exposed in line to do PCB, solder time, PCB surface will be coated with a laye
Schematic-and-PCB-source-file
- 这个是基于STC单片机制作的一款简易移动电源，里面有设计的硬件源文件，包括PCB和SCH源文件，无代码。设计软件为AD14和PADS，使用者可根据自己的意愿来自行的编写程序，开发环境使用Keil5-This is based on STC microcontroller produced a simple mobile power, which has the design of the hardware source files, including PCB and SCH source fi
A10_C21_V3.1_20131213
- 全智a10方案电路板，pads格式。对于了解平板的朋友可以看下，有参考价值特别是外围电路很多平板都差不多-Chi a10 schematic plan, dns format non-pdf. Understanding friends can look flat, a valuable reference especially a lot of the peripheral circuit are almost flat
pads-STM32-sizhou
- 基于RAM，PADS9.5的死旋翼开发原理图与PCB文件，请用PADS9.5以上版本打开！-Based on RAM, PADS9.5 death rotor develop schematics and PCB files, opened with PADS9.5 above!
BS801C
- BS801C单通道单按键触控芯片单键检测IC具有1个触摸按键，可用来检测外部触摸按键上人手的触摸动作。该系列的芯片具有较高的集成度，使用较少的外部元件便可实现触摸按键的应用-BS801C Single Channel button touch-touch-sensing IC chip having a touch keys can be used to detect human external touch pads. The series chip has a high degree of