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SMDK6410_Schematics_rev_1.0
- 三星强片S3C6410开发板的原理设计图，包括核心板，底板和液晶模块的原理图-Samsung S3C6410 film development board the principles of design, including the core board, backplane and LCD modules, schematics
Design_of_a_6.25_Gbps_Backplane_SerDes_with_TOP-do
- SerDes自顶向下的设计方法流程，包括接收机、发射机、均衡技术、时钟恢复技术-SerDes top-down design methodology process, including receivers, transmitters, equalization, clock recovery techniques
Helmholtz-resonator
- 用于计算含弹性金属背板的赫姆霍兹谐振器的内部声压-Internal sound pressure calculated with flexible metal backplane Helmholtz resonator
hmhz-cavity-
- 利用声学数值仿真软件 LMS Virtual.Lab Rev，仿真赫姆霍兹谐振器的内部声场分布及弹性背板的振动幅度频率响应-The use of acoustic numerical simulation software LMS Virtual.Lab Rev simulation Helmholtz resonator internal sound field distribution and flexible backplane vibration amplitude frequency
PCB
- Arm6410的protel格式底板PCB，原理图源文档，使用6410必备-Arm6410 in protel format backplane PCB, schematics, source documents, the use of essential 6410