已烧录的裸片（dice）在生产过程中，应注意那些问题？

Ans: 1. 晶片避免长时间暴露在强光环境下，并注意生产线上无强光等UV 环境，以免造成ROM data lose 或不可靠状

态。

2. 邦定生产建议客户采用ASM AB520 机台。

3. 客户根据不同母体采用合适线径的铝线。（一般可采用1.0 mil，但根据不同晶片pad 大小而做不同的调整）

4. 邦定机台采用适当的邦定参数，如邦定力度18～26，邦定时间20～28，邦定功率80～90。（不同的邦定机

台其参数需要微调，此点可由客户做掌控）-The die has been burned (dice) in the production process, should pay attention to those issues? Ans: 1. Wafers to avoid prolonged exposure to bright light conditions, and pay attention to the production line environment without UV light, etc., so as to avoid ROM data lose or unreliable state. 2. Bonding recommends that customers using ASM AB520 production machine. 3. Customers using appropriate according to the different diameter of the aluminum matrix. (General use 1.0 mil, but according to the size of the different chip pad to do different adjustments) 4. Bonding machine with the appropriate bonding parameters, such as bonding strength of 18 to 26, bonding time of 20 to 28, bonding power 80 ~ 90. (Different bonding machine needs fine-tuning its parameters, customers can do this in control)