BGA(ball grid array)

球形触点陈列，表面贴装型封装之一。在印刷基板的背面按陈列方式制作出球形凸点用以 代替引脚，在印刷基板的正面装配LSI 芯片，然后用模压树脂或灌封方法进行密封。也称为凸点陈列载体(PAC)。引脚可超过200，是多引脚LSI 用的一种封装。封装本体也可做得比QFP(四侧引脚扁平封装)小。例如，引脚中心距为1.5mm 的360 引脚BGA 仅为31-BGA (ball grid array) display spherical contact, surface mount type packages. In the back of the printed substrate produced by the display means to replace the pin ball bump in the printing substrate positive LSI chip assembly, and then molded resin or potting sealing methods. Also known as the Braille display vector (PAC). Pin can be more than 200, is a multi-pin LSI with a package. Package body can also better than QFP (four-side-pin flat pack) Small. For example, the center distance for the 1.5mm pin 360-pin BGA only 31