搜索资源列表
AT91SAM7SE32_ibis
- /O Buffer Information Specification (IBIS) models for AT91SAM7SE32 in LQFP and BGA package with VDDIO at 3.3V and 1.8V.
BGA
- UCOS在LPC2378开发板里面的原版移植程序
6713new1
- 6713的PCB封装图（BGA），可用protel99se打开
bga
- BGA封装详细介绍--Detailed descr iption of BGA packaging.
2812相关
- TMS320F2812引脚功能和信号情况 TMS320F2812-179引脚BGA封装底视图-TMS320F2812 and signal pin function of the TMS320F2812-179-pin BGA end View
fpga-dm9000a
- 一个项目工程，硬件包含XINLINX FPGA，配置FLASH，串口，SDRAM,与以太网芯片DM9000A，实现数据采集，以太网传输，电路验证完全正确，请放心使用，SPARTAN 3E 的BGA引脚320个，不容易布板，可以参考使用的。要FPGA实现网络通信也可以参考电路，B因为产品升级了所以公开原来的电路的。 -A project engineering, hardware contains XINLINX FPGA, configuration FLASH, serial port, SD
BGA
- BGA封装的pcb布线要点word文档，蛮好的-BGA package, pcb layout elements, is useful
PCB-package
- PCB制版使用的各种封装尺寸型号，包括BGA，LQFP-PCB plate size used in a variety of package types, including BGA, LQFP, etc.
EA-OEM-LPC1788-board
- lpc1788学校系统原理图，带LCD，非BGA封转-lpc1788 school system schematics, with LCD, non-BGA package turn
5509AZGG
- protel 下的 TI TMS320VC5509AZHH BGA封装库,加上些常用的如TSSOP28,以及TFT的接口插座封装库,自己用的希望对开发DSP 5509A的朋友有帮助.-Protel under Treasury TI TMS320VC5509AZHH BGA package, together with the more commonly used as TSSOP28, and TFT package socket interface library, with the hop
BGAlayout
- BGA 布线基础，基本的bga pcb设计要点-BGA cabling infrastructure, basic bga pcb design features
alteraBGAan114
- 推荐BGA布线方法，希望在pcb设计中有所帮助-Recommended BGA wiring, and I hope that in the pcb design help
S3C2410pin
- 自己总结的2410引脚的排列，可以很方便的找到2410在BGA上的对应位置。-Own summary of the order of 2410 pins, it is easy to find the 2410 in the corresponding position on the BGA.
6_layout
- Portel99se 格式的6层电路板，主芯片为BGA封装，对新手有参考价值-Portel99se format of six-layer circuit boards, the main chip BGA package, for novice reference value
BGA
- 随着可编程器件(PLD) 密度和I/O 引脚数量的增加，对小封装和各种封装 形式的需求在不断增长。球栅阵列(BGA) 封装在器件内部进行I/O 互联， 提高了引脚数量和电路板面积比，是比较理想的封装方案。在相同面积 上，典型的BGA 封装互联数量是四方扁平(QFP) 封装的两倍。而且，BGA 焊球要比QFP 引线强度高的多，可靠的封装能够承受更强的冲击。 Altera 为高密度PLD 用户开发了高密度BGA 解决方案。这种新的封装形 式占用的电路板面积不到标准BGA 封装
rtdsr_0.6_src.tar
- rtdsr v0.6 - RTD 1283 bootloader recovery (sources)-rtdsr: Serial Recovery utility for Realtek RTD1283/Mars SoCs This program is meant to be used in the Serial Recovery console from the Realtek RTD1283 SoC BootROM ("s/d/g/c>"). It provides
mars-hw-register-settings
- HW Settings files for RTD1283, for bootloader serial recovery-HW Settings files for RTD1283, for bootloader serial recovery: mars.BGA.64x2.bin mars.QFP.128x1.bin
BGA_rule
- BGA是PCB上常用的组件。介绍了BGA package 的走线规则。-BGA is commonly used in PCB assembly. Describes the rules for the alignment of BGA package.
FPGA_PinTes
- 简单的FPGA测试程序，测试软件为Quartus 2. 同根生成方波来测试FPGA是否焊接牢靠，特别是当封装为BGA时。-Simple FPGA test procedures, test software to Quartus 2. The same root FPGA generates a square wave to test whether the welding solid, especially when the time of BGA package.
BGA
- 各种BGA（Ball Grid Array）（焊球阵列封装），封装的PCB封装(All kinds of BGA PCB)