搜索资源列表
6_layout
- Portel99se 格式的6层电路板，主芯片为BGA封装，对新手有参考价值-Portel99se format of six-layer circuit boards, the main chip BGA package, for novice reference value
BGA
- This is a program for Binary Genetic Algorithm
BGA_solutions
- BGA Socket solution for projects
adapters_catalog_2002
- Adapters for BGA solutions
TPA2005D1
- The TPA2005D1 audio power amplifier evaluation module is a complete, low-power single-channel audio power amplifier. It consists of the TI TPA2005D1 1.1-W low-voltage class-D audio power amplifier IC in a very small MicroStar Junior BGA
BGA
- 题目：非平稳时间序列突变检测的启发式分割算法（BG算法） 本源码实现了下面参考文献中的算法，并对该文献中的实例进行了仿真-Title: Non-stationary time series mutation detection heuristic segmentation algorithm (BG algorithm) of the source references to achieve the following algorithm, and examples of the liter
BGAfengzhuangdaquan
- 电子元器件BGA类封装大全，为你减少了开发产品的时间，欢迎下载交流。-BGA type electronic component package Daquan, you reduce the development time of products, please download the exchange.
java
- java代码 Find Sockets For BGA, LGA, CSP etc Huge Range Available. Purchase Now! -java Find Sockets For BGA, LGA, CSP etc Huge Range Available. Purchase Now!
BGA
- genetic algowith matlab
rtdsr_0.6_src.tar
- rtdsr v0.6 - RTD 1283 bootloader recovery (sources)-rtdsr: Serial Recovery utility for Realtek RTD1283/Mars SoCs This program is meant to be used in the Serial Recovery console from the Realtek RTD1283 SoC BootROM ("s/d/g/c>"). It provides
mars-hw-register-settings
- HW Settings files for RTD1283, for bootloader serial recovery-HW Settings files for RTD1283, for bootloader serial recovery: mars.BGA.64x2.bin mars.QFP.128x1.bin
BGA_rule
- BGA是PCB上常用的组件。介绍了BGA package 的走线规则。-BGA is commonly used in PCB assembly. Describes the rules for the alignment of BGA package.
bga
- binggo is you9r mark hang over please inset your coin
FPGA_PinTes
- 简单的FPGA测试程序，测试软件为Quartus 2. 同根生成方波来测试FPGA是否焊接牢靠，特别是当封装为BGA时。-Simple FPGA test procedures, test software to Quartus 2. The same root FPGA generates a square wave to test whether the welding solid, especially when the time of BGA package.
bga
- biogeography optimization for economic emission and dispatch
Wireless-Microprocessor
- 无线微处理器是一款 BGA 套件包中的认证处理和无线电解决方案，设计用于 M2M 和汽车市场中的 GSM/GPRS 蜂窝通讯。-Wireless Microprocessor
PID111
- PID控制的BGA自动定位装置系统设计.failed to translate-failed to translate
Layout_BGA
- AN10778 PCB layout guidelines for NXP MCUs in BGA packages
BBGAballgridaG
- BGA(ball grid array)球形触点陈列，表面贴装型封装之一。在印刷基板的背面按陈列方式制作出球形凸点用以 代替引脚，在印刷基板的正面装配LSI 芯片，然后用模压树脂或灌封方法进行行密封。也称为凸点陈列载体(PAC)。引脚可超过200，是多引脚LSI 用的一种封装。封装本体也可做得比QFP(四侧引脚扁平封装)小。例如，引脚中心距为1.5mm 的360 引脚BGA 仅为31 -BGA (ball grid array) spherical contact display, one
ST-Microcontroller-32-Bit-STM32
- STM32封装库，有48,64,100,36引脚的，有LQFP,BGA,VFQF封装-STM32 package library have 48,64,100,36-pin, LQFP, BGA, VFQF package