资源列表
DS18B20
- 由汇编语言编写的基于DS18B20的多点温度检测程序源码,程序调试通过,不用作改动就可以运行在单片机系统中。-Prepared by the assembly language DS18B20 based multi-point temperature of the source detection procedure, program debugging through, do not make changes to be able to run in single-chip system.
NONAME1
- 此程序用164扩展键盘和显示功能,最大限度的少用IO口-Expansion of this program with 164 keyboard and display functions, to maximize the use of the IO I
1
- 单片机的入门小程序,用它来来扫描键盘,并根据不同的按键方式,显示不同流水灯-Procedures for the entry of small single-chip, to use it to scan the keyboard and buttons according to different methods show different water lights
2007829945374711
- 是一个汇编延时程序,适合初学者使用,当P1.0端口输出高电平,即P1.0=1时,根据发光二极管的单向导电性可知,这时发光二极管L1熄灭;当P1.0端口输出低电平,即P1.0=0时,发光二极管L1亮;我们可以使用SETB P1.0指令使P1.0端口输出高电平,使用CLR P1.0指令使P1.0端口输出低电平。 -Delay is a compilation of procedures, suitable for beginners to use, when the high output po
pingmuchuangkouchengxu
- 详见压缩文件,关于屏幕窗口程序的汇编语言-See compressed file, a window on the screen of the assembly language program
tongjixueshengchengji
- 有关统计学生成绩的汇编程序,详见压缩文件内容-Relating to the compilation of statistics on student achievement program, as detailed in the contents of compressed files
4matrixkeyboard
- AT89S51的并行口P1接4×4矩阵键盘,以P1.0-P1.3作输入线,以P1.4-P1.7作输出线;在数码管上显示每个按键的“0-F”序号。-AT89S51 the parallel port P1 then 4 × 4 matrix keyboard to P1.0-P1.3 as input lines to P1.4-P1.7 for output line in the digital control button displayed on each of the " 0-
work
- svm在matlab中的应用的一些程序以及说明-svm application in matlab some of the procedures
SHUZI
- 利用8051芯片制作一个数字电压表,能够测量电压并用4段数码管显示。-Manufactures a digital voltmeter using 8051 chips, can survey the voltage and demonstrate with 4 sections of nixietubes.
serials
- SerialS.asm实现查询方式半双工串行通信接口实验-发送端程序查询方式半双工串行通信发送程序-Inquiries SerialS.asm way to achieve half-duplex serial communication interface experiment- client program to send query to send half-duplex serial communication program
Chapter02
- Windows环境下32位汇编语言程序设计配套书源码第二章-failed to translate
Chapter03
- Windows环境下32位汇编语言程序设计配套书源码第三章-Windows Environment 32-bit assembly language programming book source package in Chapter III
