球形触点陈列，表面贴装型封装之一。在印刷基板的背面按陈列方式制作出球形凸点用以代替引脚，在印刷基板的正面装配LSI芯片，然后用模压树脂或灌封方法进行密封。-Spherical contact on display, one of surface mount package. In the back of the printed substrate produced by the display means to replace the pin ball bump, substrate in the printing of a positive LSI chip assembly, and then molded resin or potting sealing methods.